SMKTOP > Series List：Board to Wire Connectors > Series Outline：ID-Multi（Top Entry Type）
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Series
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ID-Multi（Top Entry Type） Series
Wire to Board ID Method Connectors
Features
- 1. Small and low profile type wire to board ID method connector of 0.8mm pitch and 1.2mm mating height.
- 2. Due to original contact design, supports multiple pin connections.
- 3. Resistant to vibration and shocks when dropped and highly reliable due to a 2point contact structure.
- 4. Cable connection helping to achieve excellent cable retention performance and contact reliability due to double insulation displacement slots at the front and back.
- 5. A top entry mating structure where the wire emerges horizontally.
- 6. Excellent mating retention force in addition to ensured clicking feeling during insertion and withdrawal due to the mold locking structure.
- 7. Supplied in the embossed taping with automatic mounter.
- 8. Country of Origin：Japan, China
Specification
| Pitch： | 0.8mm |
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| Number of Pins： | 2,3,4 |
| Rating： | AC/DC 30V 1A |
| Method for Connection： | Insulation displacement |
| Applicable Electrical Wire： | AWG32 |
| Connection Form： | 2piece |
| Contact Resistance： | 20m Ω max., initially |
| Insulation Resistance： | 100M Ω min.at 250V DC |
| Withstanding Voltage： | 250V AC (for one minute) |
| Operating Temperature Range： | -25℃～＋80℃ |
Material and Plating
| Housing： | Thermoplastic Resin |
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| Contact： | Cu Alloy, Au Plating |
| Hold Down： | Cu Alloy, Sn Plating |
| Terminal： | Cu Alloy, Au Plating |
Application
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Mobile phones, smartphones, digital cameras, PDAs, and other mobile equipment.
